Polyflon Bonding Film
Polyflon’s thermally-stabilized, polyolefin thermoplastic bonding film is a low-melting-point film that has been developed for stripline packages and other multilayer circuits. Polyflon bonding film is 0.002 in. (51 µm) thick and is available in sheets measuring 24 in. x 36 in.. It is also available in roll form.
Key Benefits
- Low dielectric constant and low loss tangent at microwave frequencies
- Low melt profile for temperature critical materials
- Can be reheated to re-flow bonding film
- Low flow to limit flow in cutouts and pockets
- RoHS compliant
Typical Applications
- Stripline circuitry
- Multi-layer boards and hybrid constructions for microwave applications
- Attachment of circuit boards to heavy plate heat sinks