Polyflon Bonding Film


Polyflon’s thermally-stabilized, polyolefin thermoplastic bonding film is a low-melting-point film that has been developed for stripline packages and other multilayer circuits. Polyflon bonding film is 0.002 in. (51 µm) thick and is available in sheets measuring 24 in. x 36 in.. It is also available in roll form.

Key Benefits

  • Low dielectric constant and low loss tangent at microwave frequencies
  • Low melt profile for temperature critical materials
  • Can be reheated to re-flow bonding film
  • Low flow to limit flow in cutouts and pockets
  • RoHS compliant

Typical Applications

  • Stripline circuitry
  • Multi-layer boards and hybrid constructions for microwave applications
  • Attachment of circuit boards to heavy plate heat sinks

Available Documents